Composite Materials and Mechanics Laboratory

Innovation in Lightweight Materials

An Educational Initiative on Cybersecurity in Additive Manufacturing

Sponsor: National Science Foundation (2019-2022)

Additive manufacturing (AM), widely known as 3D printing, is the process of making three dimensional objects from a digital file. AM is enabling product innovation in a wide range of fields including automobiles, aircraft, spacecraft, toys, consumer products, food and medical implants and devices. A 3D printer is now located on the International Space Station to print parts on demand. Such high-value parts are designed by making extensive use of design, simulation and analysis tools, including high-performance computing, and make use of cloud-based resources throughout the process chain. In this project, New York University (NYU) is partnering with New York City College of Technology (City Tech) to educate students and to engage a wide range of stakeholders as the project builds capacity in the emerging field of AM security. The project will first develop an introductory graduate level course on AM security to be taught at both schools. This course will be part of a new Master of Science program and a new certificate program, both in AM. An on-line version of the course will also be offered. Complementing the course, the project will organize the HACK3D hackathon to build the security mindset of students for approaching digital manufacturing. In addition, the project will start an annual workshop and undergraduate summer research program in innovative research on the cybersecurity of digital manufacturing. The educational framework in this project will be first of its kind to address the security challenge in AM field by a collaborative team of a mechanical engineer and a computer science cybersecurity expert.

Participants:

Publications:

Panel Discussions:

Panel 1: July 31, 2020: Additive Manufacturing Security: Intellectual Property Protection. Watch on Youtube.

Panel 2: August 24, 2020: Increasing diversity in cyber-physical system research and workforce. Watch on Youtube.

Panel 3: October 2, 2020: Additive Manufacturing Security: Design, materials and sensor based solutions.  Watch on Youtube.

Panel 4: November 5, 2020: Cybersecurity in Manufacturing: Threat Modeling and Solutions. Watch on Youtube.

AM Security Course

The graduate level AM Security course has been developed and offered at NYU by Dr. Gupta and Dr. Ramesh Karri in Fall 2020 semester. The NY City Tech PIs Dr. Gaffar Gailani and Dr. XiangDong Li are also collaborating on this course.

The course contents can be found in This document.

Hack3D: Manufacturing Security Challenge

Hack3D is the first manufacturing security challenge that is being organized by our team since 2018.

The 2020 Hack3D challenge was released on September 15, 2020 and the solutions were due on October 15, 2020. For more information, visit Hack3D Website. 

The first introductory call with the 2020 Hack3D participants can be accessed here.

The second introductory call with the 2020 Hack3D participants can be accessed here.

The final presentations of the 2020 Hack3D participants can be accessed here.